Substrate and method of forming substrate for fluid ejection device
US7530661B2 · kind B2 · utility
1Cited by
9References
32Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 24, 2006 |
| Grant date | May 12, 2009 |
| Priority date | — |
| Expiry date | Jun 12, 2027 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/1631
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A substrate for a fluid ejection device includes a first side, a second side opposite the first side, and a fluidic channel communicating with the first side and the second side. A first portion of the fluidic channel extends from the first side toward the second side, a second portion of the fluidic channel extends from the second side toward the first side, and a third portion of the fluidic channel extends from an interface between the first portion and the second portion of the fluidic channel toward the second side.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.