Providing variable sized contacts for coupling with a semiconductor device
US7530814B2 · kind B2 · utility
10Cited by
9References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2007 |
| Grant date | May 12, 2009 |
| Priority date | — |
| Expiry date | Sep 25, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In one embodiment, the present invention includes a circuit board having integrated contacts to mate with corresponding pads of a semiconductor device. At least some of the integrated contacts are of varying sizes to enable different contact resistances between the corresponding integrated contacts and pads, enabling reduced loading forces to adapt the semiconductor device to the circuit board. Other embodiments are described and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.