Laser ablation of welded seam area
US7531283B2 · kind B2 · utility
7Cited by
4References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2005 |
| Grant date | May 12, 2009 |
| Priority date | — |
| Expiry date | Oct 25, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/764
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A seamless flexible electrophotographic imaging member comprising a flexible substrate strip material having an unmelted photodecomposed seam of carbon-black loaded polyimide polymer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.