Thick film capacitors on ceramic interconnect substrates
US7531416B2 · kind B2 · utility
1Cited by
20References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2005 |
| Grant date | May 12, 2009 |
| Priority date | — |
| Expiry date | Jul 2, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10689
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Thick-film capacitors are formed on ceramic interconnect substrates having high capacitance densities and other desirable electrical and physical properties. The capacitor dielectrics are fired at high temperatures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.