Lateral SOI semiconductor device
US7531875B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 13, 2003 |
| Grant date | May 12, 2009 |
| Priority date | — |
| Expiry date | May 13, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/127
Abstract
This invention is generally concerned with semiconductor-on-insulator devices, particularly for high voltage applications. A lateral semiconductor-on-insulator device is described, comprising: a semiconductor substrate; an insulating layer on said semiconductor substrate; and a lateral semiconductor device on said insulator; said lateral semiconductor device having: a first region of a first conductivity type; a second region of a second conductivity type laterally spaced apart from said first region; and a drift region extending in a lateral direction between said first region and said second region; and wherein said drift region comprises at least one first zone and at least one second zone adjacent a said first zone, a said first zone having said second conductivity type, a said second zone being an insulating zone, a said first zone being tapered to narrow towards said first region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.