Multi-layer solid state keyboard
US7532131B2 · kind B2 · utility
10Cited by
11References
30Claims
0Family size
Inventors
Key dates
| Filing date | Apr 22, 2004 |
| Grant date | May 12, 2009 |
| Priority date | — |
| Expiry date | Aug 5, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01H2219/002
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A keypad includes a substrate and one or more layers of decorative material on the substrate. Transparent and/or conventional conductive materials are disposed on the decorative material. Electrical circuit components are soldered to the conductive layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.