Built-in capacitor type wiring board and method for manufacturing the same
US7532453B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 20, 2006 |
| Grant date | May 12, 2009 |
| Priority date | — |
| Expiry date | Jul 20, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10712
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In order to provide a built-in capacitor type wiring board capable of preventing misalignment of the capacitor, a capacitor built-in type wiring board is provided which includes a core board; a multilayer portion disposed on at least one side of the core board and formed by a plurality of interlayer insulating layers; and a plurality of conductor layers alternately laminated on the core board. The capacitor is of a chip-like shape with first and second main surfaces and includes a dielectric layer; electrode layers laminated on the dielectric layer; and a hole portion opening at least at the second main surface. The capacitor is embedded in the interlayer insulating layers so that the second main surface faces the core board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.