Slurry composition for secondary polishing of silicon wafer
US7534277B2 · kind B2 · utility
1Cited by
5References
6Claims
0Family size
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Key dates
| Filing date | Jul 30, 2003 |
| Grant date | May 19, 2009 |
| Priority date | — |
| Expiry date | May 4, 2024 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09G1/02
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Disclosed is a slurry composition for secondary polishing of silicon wafers comprising: 2˜10 weight % of colloidal silica having an average particle size of 30˜80 nm; 0.5˜1.5 % by weight of ammonia; 0.2˜1 weight % of a hydroxyalkycellulose-based polymer for modifying rheology of the composition; 0.03˜0.5 weight % of a polyoxyethylenealkylamine ether-based nonionic surfactant; 0.01˜1 weight % of a quaternary ammonium base and the balance of deionized water.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.