Thermoset polyimides for microelectronic applications
US7534649B2 · kind B2 · utility
3Cited by
8References
10Claims
0Family size
Assignee
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Key dates
| Filing date | May 12, 2006 |
| Grant date | May 19, 2009 |
| Priority date | — |
| Expiry date | Jun 27, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Dendrimer/hyperbranched materials are combined with polyimide to form a low CTE material for use as a dielectric substrate layer or an underfill. In the alternative, ruthenium carbene complexes are used to catalyze ROMP cross-linking reactions in polyimides to produce a class of cross-linkable, thermal and mechanical stable material for use as a dielectric substrate or underfill. In another alternative, dendrimers/hyperbranched materials are synthesized by different methods to produce low viscosity, high Tg, fast curing, mechanically and chemically stable materials for imprinting applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.