Resin composition and multi-layer structures
US7534829B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 20, 2003 |
| Grant date | May 19, 2009 |
| Priority date | — |
| Expiry date | Dec 19, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1393
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Provided is a resin composition comprising 1-99% by weight of a modified ethylene-vinyl alcohol copolymer (C) having an ethylene content of 5-55 mol %, which contains a specific structural unit (I) in an amount of 0.3-40 mol % and can be obtained by reacting an ethylene-vinyl alcohol copolymer (A) with a monofunctional epoxy compound (B) having a molecular weight of not more than 500, and 1-99% by weight of a thermoplastic resin (T1) other than (C). Moreover, a multilayer structure in which the resin composition and a thermoplastic resin (T2) are laminated is also provided. Thus, a resin composition superior in barrier properties, transparency, stretchability, flexibility, flexing resistance and interlayer adhesiveness and various kinds of molded articles made thereof are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.