Flexible multilayer packaging material and electronic devices with the packaging material

US7535017B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Georg Wittmann · Herzogenaurach, DE
• Debora Henseler · Erlangen, DE
• Karsten Heuser · Erlangen, DE
• Ralph Paetzold · Roth, DE

Key dates

• Filing date: Apr 2, 2004
• Grant date: May 19, 2009
• Expiry date: Apr 2, 2024

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02P70/50

Abstract

The invention discloses a flexible multilayer packaging material for protecting articles that are sensitive to moisture and oxidizing agents. The packaging material has at least one active polymeric barrier layer that is able to bind the moisture and oxidizing agents and at least one ceramic barrier layer. The combination of the active polymeric barrier layer and the ceramic barrier layer significantly enhances the barrier abilities of the multilayer packaging material.