Self-assembly microstructure with polyimide thin-film elastic joint
US7535068B2 · kind B2 · utility
1Cited by
1References
10Claims
0Family size
Assignee
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Key dates
| Filing date | Oct 13, 2005 |
| Grant date | May 19, 2009 |
| Priority date | — |
| Expiry date | Jan 25, 2027 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B7/0003
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
The invention relates to a self-assembly microstructure with a polyimide thin-film elastic joint, which contains at least one stationary part of the microstructure and at least one movable part of the microstructure. An elastic joint located between the stationary part and the movable part is a photosensitive polyimide thin film material. The polyimide elastic joint is contracted after high-temperature reflow process. The surface tension force of cured polyimide can rotate and lift-up the movable part of the microstructure in completion of the self-assembly of the microstructure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.