Self-emission panel and method of manufacturing same
US7535164B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 13, 2006 |
| Grant date | May 19, 2009 |
| Priority date | — |
| Expiry date | Aug 18, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/00
Abstract
A self-emission panel and a method of manufacturing a self-emission panel which can prevent emission failures from occurring due to various factors, thereby achieving a self-emission panel that is free from emission failures. The self-emission panel is manufactured by forming a first conductive layer on a substrate directly or via other layers, forming a deposition layer including a luminescent layer on the first conductive layer, and forming a second conductive layer on the deposition layer. This manufacturing method includes: a first step of forming a sectioning layer for sectioning an opening for making a emission area on the first conductive layer after the formation of the first conductive layer; a second step of applying surface treatment to at least the surface of the first conductive layer inside the opening; and a third step of depositing a deposition layer on the first conductive layer given surface treatment in the second step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.