Fan integrated thermal management device
US7535708B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 19, 2006 |
| Grant date | May 19, 2009 |
| Priority date | — |
| Expiry date | May 25, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/20
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A fan integrated thermal management device, such as a heat sink, may include an integrated fan to facilitate air flow through the device. One embodiment of the thermal management device may include a heat-conductive base and a plurality of heat-conductive extensions extending from the base and defining one or more fan blade regions. One or more fans may be mounted relative to the heat-conductive extensions such that at least one fan blade is located in the fan blade region and is configured to rotate through the fan blade region. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.