System and method for assembling components in an electronic device
US7535726B2 · kind B2 · utility
0Cited by
20References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 8, 2006 |
| Grant date | May 19, 2009 |
| Priority date | — |
| Expiry date | May 27, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention provides a system of components in an electronic device. The system comprises: a PCB; a first component mounted to the PCB; a cap located about the first component; a second component; and a platform for the second component. In the system, the platform and the cap cooperate with alignment features such that the platform may be placed on top of the cap at a predetermined location utilizing the alignment features. The invention also provides a method for assembling the device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.