VCSEL with integrated lens
US7535949B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 9, 2007 |
| Grant date | May 19, 2009 |
| Priority date | — |
| Expiry date | Mar 9, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/18388
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A wafer-level device fabrication process forms standing structures around emitting areas of multiple VCSELs. The standing structures can be shaped to hold ball lenses or other optical elements for respective VCSELs or can include platforms on which optical elements are formed. Ball lenses that are attached to the standing structures either during chip-level or wafer-level processes fit into the standing structures and are automatically aligned. Wafer level fabrication of optical elements can align the optical elements with accuracies associated with photolithographic processes. The optical elements can be formed using a molding or replication process, a printing method, or surface tension during a reflow of lithographically formed regions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.