Method of fabricating an acoustic transducer
US7536769B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 25, 2006 |
| Grant date | May 26, 2009 |
| Priority date | — |
| Expiry date | Jun 9, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4908
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An acoustic pressure type sensor is fabricated on a supporting substrate by depositing and etching a number of thin films on the supporting substrate and by machining the supporting substrate. The resulting structure contains a pressure sensitive, electrically conductive diaphragm positioned at a distance from an electrically conductive fixed electrode. In operation, the diaphragm deflects in response to an acoustic pressure and the corresponding change of electrical capacitance between the diaphragm and the fixed electrode is detected using an electrical circuit. Two or more such acoustic sensors are combined on the same supporting substrate with an interaural flexible mechanical connection, to form a directional sensor with a small surface area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.