Method of assembling an application specific integrated circuit (ASIC) assembly with attach hardware
US7536781B2 · kind B2 · utility
4Cited by
9References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 6, 2003 |
| Grant date | May 26, 2009 |
| Priority date | — |
| Expiry date | May 24, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53178
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of assembling an Application Specific Integrated Circuit (ASIC) assembly with attach hardware includes selecting a thickness of a load washer based on a target load to be applied by said attach hardware.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.