Three-dimensional multi-chips and tri-axial sensors and methods of manufacturing the same

US7536909B2 · kind B2 · utility

Assignee

• MEMSIC, INC. · US

Inventors

• Yang Zhao · North Andover, US
• Feiming Huang · 安丰镇, CN
• Zongya Li · Wuxi, CN

Key dates

• Filing date: Jan 20, 2006
• Grant date: May 26, 2009
• Expiry date: May 30, 2027

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/10253
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

Devices for providing tri-axial measurements in an x-direction, a y-direction, and a z-direction and methods of their manufacture are disclosed. The devices comprise a leadframe, at least one X- and Y-axis sensor die, at least one integrated circuit, and a Z-axis sensor. The Z-axis sensor is encapsulated in a pre-molding before the leadframe, X- and Y-axis sensor die(s), integrated circuit(s), and the pre-molding are encapsulated to provide a final molding.