Cutting method of fabric material
US7536937B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 2, 2004 |
| Grant date | May 26, 2009 |
| Priority date | — |
| Expiry date | May 31, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/283
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A fabric material has a base fabric, a pile layer on a surface of the base fabric, and an adhesive layer of a hot-melt adhesive on another surface of the base fabric. The adhesive layer contains a wax whose melting point Tm1 is from 20° C. to 50° C. lower than the melting point Tm2 of the base polymer. The fabric material is heated by a heating device to at least (Tm1+5)° C. and (Tm2−5)° C., and then cut by a ultrasonic wave cutter 23. Thus the fabric material can be cut without generating the chaffs of the adhesive agent and the fiber offscums. As a result, the pollution is not made in the cutting process, and the cutting of the fabric material is made continuously and stably. Without the adhesion of the chaffs, the teremp which has a good surface formed by the cutting.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.