Integrated liquid cooling system for electronic components
US7537048B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 15, 2006 |
| Grant date | May 26, 2009 |
| Priority date | — |
| Expiry date | Apr 4, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
An integrated liquid cooling system (100) includes a heat absorbing member (10), a heat dissipating member (20) and a pump (15). The heat absorbing member defines therein a fluid flow channel (115) for passage of a coolant and a pump receiving housing (120) adjacent to the fluid flow channel. The heat dissipating member is mounted to and maintained in fluid communication with the heat absorbing member. The pump is received in the pump receiving housing of the heat absorbing member. The pump is configured for driving the coolant to circulate through the heat absorbing member and the heat dissipating member. The heat absorbing member, the heat dissipating member and the pump of the liquid cooling system are combined together to form an integrated structure without utilizing any connecting pipes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.