Patent · US Active

Method for forming a connector assembly for use with an implantable medical device

US7537493B2 · kind B2 · utility

3Cited by
3References
7Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 11, 2008
Grant dateMay 26, 2009
Priority date
Expiry dateJul 11, 2028

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T29/49146
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

A sectional interconnect ribbon for use in a connector assembly for an implantable medical device is formed of two ore more separately-formed sections which are mechanically joined together to form an integral assembly. The sectional interconnect ribbon, as well as at least one connection element, is embedded within the connector assembly.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.