Method of fabricating a miniature silicon condenser microphone
US7537964B2 · kind B2 · utility
95Cited by
54References
24Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 3, 2006 |
| Grant date | May 26, 2009 |
| Priority date | — |
| Expiry date | Oct 3, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4908
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A silicon condenser microphone package includes a transducer unit, a substrate, and a cover. The substrate includes an upper surface transducer unit is attached to the upper surface of the substrate and overlaps at least a portion of the recess wherein a back volume of the transducer unit is formed between the transducer unit and the substrate. The cover is placed over the transducer unit and either the cover or the substrate includes an aperture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.