Substrate-enhanced electroless deposition (SEED) of metal nanoparticles on carbon nanotubes
US7538062B1 · kind B1 · utility
19Cited by
5References
12Claims
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Key dates
| Filing date | Sep 11, 2006 |
| Grant date | May 26, 2009 |
| Priority date | — |
| Expiry date | Jul 26, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/89
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
An electroless deposition method of depositing metal nanoparticles onto conductive substrates such as carbon nanotubes is provided. The carbon nanotubes are provided on a support comprising a metal substrate and then immersed in an aqueous solution containing metal ions. The metal substrate metal has a redox potential which is lower than that of the metal ions in solution such that the metal ions are readily reduced into metal nanoparticles on the carbon nanotubes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.