Methods and apparatus for utilizing an optical reference

US7538564B2 · kind B2 · utility

Assignee

• The GSI Group, LLC · US

Inventors

• Jonathan S. Ehrmann · Sudbury, US
• Patrick S. Duffy · Andover, US
• Markus Weber · Kelmscott, AU
• Gregg A. Metzger · Andover, US
• Joseph V. Lento · Methuen, US
• Pierre-Yves Mabboux · Billerica, US
• Jens Zink · Lakeville, US
• Yun Fee Chu · Natick, US

Key dates

• Filing date: Oct 18, 2006
• Grant date: May 26, 2009
• Expiry date: Oct 28, 2026

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B23K26/705
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A laser processing system implements a method for aligning a probe element (e.g., a probe pin) with a device interface element (e.g., a contact pad of a circuit substrate). First, the laser processing system generates an optical reference beam at one or more predetermined positions to calibrate a reference field. The laser processing system then detects a position of the probe element in the reference field. The laser processing system also determines a relative position of the device interface element in the reference field. Based on the position of the probe element and the device interface element, the laser processing system then initiates alignment of the probe element and the device interface element. In one application, alignment of the probe element and the device interface element further includes contacting the probe element to the device interface element to make an electrical connection.