Force distributing spring element
US7539027B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 29, 2007 |
| Grant date | May 26, 2009 |
| Priority date | — |
| Expiry date | Oct 29, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1061
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A force distributor is configured for disposition between a printed circuit board and a stiffening plate, which is spaced from the printed circuit board. The force distributor is configured to distribute a compressive force between the printed circuit board, an interposer and a land grid array module carried on a side of the printed circuit board opposite the stiffening plate. The force distributor comprises a spring element comprising a first portion and a second portion with the first portion extending radially outward from the second portion. The spring element is configured for placement so that the first portion is secured to the stiffening plate and the second portion is biased in unsecured, pressing contact against the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.