Optical transceiver module
US7539366B1 · kind B1 · utility
55Cited by
9References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 4, 2008 |
| Grant date | May 26, 2009 |
| Priority date | — |
| Expiry date | Jan 4, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10121
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optical module. The optical module includes a printed circuit board and an opto-chip. The opto-chip includes a transparent carrier with an optoelectronic device array and an associated integrated circuit array that are flip chip attached to the transparent carrier. The optoelectronic device array and the associated integrated circuit array are interconnected via surface wiring with bond sites. In addition, the associated integrated circuit array extends beyond the transparent carrier to provide direct flip chip attachment of the opto-chip to the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.