Laminated member for circuit board, method and apparatus for manufacturing of circuit board
US7540079B2 · kind B2 · utility
28Cited by
0References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 21, 2004 |
| Grant date | Jun 2, 2009 |
| Priority date | — |
| Expiry date | Jan 6, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board-use member has a reinforcing plate, a removable organic layer, a flexible film having a circuit pattern, and a peeling-assist layer laminated in that order;
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.