Plastic card, plastic card manufacturing method, plate for heat press, and card manufacturing apparatus
US7540314B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 5, 2005 |
| Grant date | Jun 2, 2009 |
| Priority date | — |
| Expiry date | Nov 7, 2027 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB42D25/373
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Collation and welding of card component sheets can be performed in a simple facility. Plastic cards such as IC cards having substantially no distortion and twisting are provided. A round hole (17) and an ellipse hole (18) are formed at the corresponding positions in layered component sheets (19a to 19d), and positioning pins (21) are inserted and passed through respective holes. Since at this occasion, the ellipse hole (18) has play relative to the positioning pin (21), the distortion and twisting of each card component sheet can be adsorbed, and the appearance can be improved by avoiding printing dislocation and the like. It is also able to prevent mechanical strength from lowering due to residual stress.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.