Method of foming a micromechanical structure
US7541280B2 · kind B2 · utility
1Cited by
8References
24Claims
0Family size
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Key dates
| Filing date | Aug 13, 2004 |
| Grant date | Jun 2, 2009 |
| Priority date | — |
| Expiry date | Nov 21, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/0109
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method of forming a micromechanical structure, wherein at least one micromechanical structural layer is provided above a substrate. The micromechanical structural layer is sustained between a lower sacrificial silicon layer and an upper sacrificial silicon layer, wherein a metal silicide layer is formed between the lower and upper sacrificial silicon layers to increase interface adhesion therebetween. The upper sacrificial silicon layer, the metal silicide layer and the lower sacrificial silicon layer are then removed to release the micromechanical structural layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.