Curable resin composition, curable film and cured film
US7541408B2 · kind B2 · utility
2Cited by
0References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 16, 2005 |
| Grant date | Jun 2, 2009 |
| Priority date | — |
| Expiry date | Jul 21, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4676
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A curable resin composition containing as essential components a high molecular weight compound having a weight average molecular weight of at least 10,000 and a vinyl compound of the formula (1).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.