Electronic circuit configuration having a printed circuit board thermally coupled to a heat sink

US7542291B2 · kind B2 · utility

Assignee

• Siemens VDO Automotive AG · US

Inventors

• Volker Karrer · Regensburg, DE
• Bernhard Lichtinger · Unterschleißheim, DE
• Johannes Mehler · Regensburg, DE
• Folker Renken · Regensburg, DE
• Florian Schupp · Regensburg, DE
• Arnoud Smit · Erlangen, DE

Key dates

• Filing date: Jun 22, 2007
• Grant date: Jun 2, 2009
• Expiry date: Jul 21, 2027

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/48227
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

In order to improve the heat dissipation capacity in an electronic circuit configuration with one or more printed circuit boards thermally coupled by one flat side to a heat sink having at least one coolant duct, the flat side immediately adjoins the coolant duct.