Patent · US Expired

Device with a radiation-emitting semiconductor component and procedure for the temperature stabilization of a radiation-emitting semiconductor component

US7542494B2 · kind B2 · utility

0Cited by
8References
32Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 24, 2005
Grant dateJun 2, 2009
Priority date
Expiry dateJul 16, 2025

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01S5/06804
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

A device having at least one radiation-emitting semiconductor component (1), the semiconductor component being assigned at least one electrical heating element (2) designed for heating the semiconductor component. Furthermore, a method for the temperature stabilization of the operating temperature of a radiation-emitting semiconductor component (1) of a device is specified, the semiconductor component being assigned an electrical heating element (2), by means of which the semiconductor component is heated when the operating temperature of the semiconductor component falls below a predetermined desired value of the operating temperature. The semiconductor component can be assigned a temperature sensor (4) for monitoring the operating temperature of the semiconductor component.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.