Device with a radiation-emitting semiconductor component and procedure for the temperature stabilization of a radiation-emitting semiconductor component
US7542494B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 24, 2005 |
| Grant date | Jun 2, 2009 |
| Priority date | — |
| Expiry date | Jul 16, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/06804
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A device having at least one radiation-emitting semiconductor component (1), the semiconductor component being assigned at least one electrical heating element (2) designed for heating the semiconductor component. Furthermore, a method for the temperature stabilization of the operating temperature of a radiation-emitting semiconductor component (1) of a device is specified, the semiconductor component being assigned an electrical heating element (2), by means of which the semiconductor component is heated when the operating temperature of the semiconductor component falls below a predetermined desired value of the operating temperature. The semiconductor component can be assigned a temperature sensor (4) for monitoring the operating temperature of the semiconductor component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.