Stress-relieved diamond inserts
US7543662B2 · kind B2 · utility
41Cited by
20References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 7, 2006 |
| Grant date | Jun 9, 2009 |
| Priority date | — |
| Expiry date | Jun 9, 2026 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE21B10/573
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
A drill bit including at least one stress-relieved cutting element, wherein the at least one cutting element is mounted on the drill bit, wherein the stress-relieved cutting element includes a substrate, at least one transition layer disposed upon the substrate and a polycrystalline diamond layer having a thickness of at least 0.008 inches disposed upon the at least one transition layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.