Light-emitting diode assembly
US7543960B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 26, 2007 |
| Grant date | Jun 9, 2009 |
| Priority date | — |
| Expiry date | Mar 24, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10106
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A light-emitting diode (LED) assembly includes a circuit board (10), at least one LED (20) being electrically connected with and being arranged on a side of the circuit board, and a heat dissipation apparatus (40) being arranged on an opposite side of the circuit board. The circuit board defines at least one through hole (102) corresponding to a position of the at least one LED. Thermal interface material (140) is filled in the at least one hole of the circuit board to thermally interconnect the at least one LED and the heat dissipation apparatus. The thermal interface material is a composition of nano-material and macromolecular material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.