Method and apparatus for removing thin metal films
US7544283B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 11, 2005 |
| Grant date | Jun 9, 2009 |
| Priority date | — |
| Expiry date | Dec 21, 2026 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25F5/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A system for removing a thin metal film is disclosed. The system comprises an inclined metal plate electrode for guiding a downward electrolyte flow, an auxiliary electrode placed on either the upstream or downstream side of the metal plate electrode such that a part of the auxiliary electrode is immersed into the electrolyte, and a power supply for applying a DC voltage to the both electrodes. The system is used to remove a metal thin film on the surface of an insulator by making the electrolyte flowing down the metal plate electrode strike against the metal thin film while the DC voltage is applied to the metal plate electrode and auxiliary electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.