Method for applying mechanically sensitive layers to a substrate over a large area

US7544383B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Jan Birnstock · Dresden, DE
• Joerg Blaessing · Oberkochen, DE
• Karsten Heuser · Erlangen, DE
• Matthias Stoessel · Mannheim, DE
• Georg Wittmann · Herzogenaurach, DE

Key dates

• Filing date: Oct 11, 2002
• Grant date: Jun 9, 2009
• Expiry date: Jun 11, 2025

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10K71/00

Abstract

A method is described for large-area application of at least two, for example, electroluminescent layers onto a substrate. In a process step A), spacer (5) is structured on the transparent substrate in such a way that, upon application of a second functional layer (11), contact between a first functional layer (10) already applied on the substrate and a part of a printing machine responsible for the transfer of the functional layers onto the substrate is avoided. In two other process steps B) and C), the first functional layer (10) and the second functional layer (15) are applied over a large area, for example, through large-area standard printing methods.