Method and apparatus for providing optoelectronic communication with an electronic device
US7544527B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 11, 2006 |
| Grant date | Jun 9, 2009 |
| Priority date | — |
| Expiry date | Dec 2, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73253
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optoelectronic assembly for an electronic system includes a thermally conductive, metallized transparent substrate having a first surface and an opposite second surface. A support chip set is bonded to the transparent substrate. A first substrate is in communication with the transparent substrate via the second surface and support chip set therebetween. A second substrate is in communication with the second surface of the first substrate and is configured for mounting at least one of data processing, data switching and data storage chips. An optoelectronic transducer is in signal communication with the support chip set, and an optical signaling medium having one end with an optical fiber array aligned with the transducer is substantially normal to the first surface of the transparent substrate. The support chip set and the transducer share a common thermal path for cooling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.