Semiconductor mount
US7545011B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 24, 2006 |
| Grant date | Jun 9, 2009 |
| Priority date | — |
| Expiry date | Jan 20, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/52
Abstract
A mount for a semiconductor device has a first surface with at least one contact region and a second surface. The mount has a substrate to receive the second surface of the semiconductor device and a planar element. The planar element has an aperture sized to surround the semiconductor. A first surface of the planar element is mounted to the substrate and is located to surround the semiconductor device such that the semiconductor device is aligned by the aperture. The mount further has means for mounting the semiconductor device to the substrate in an aligned position. Some embodiments include a method of making and/or using such a mount.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.