Chip-scale coils and isolators based thereon
US7545059B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 9, 2007 |
| Grant date | Jun 9, 2009 |
| Priority date | — |
| Expiry date | Feb 9, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04B5/75
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Coil structures and isolators using them. A coil(s) is (are) used as a magnetic field-generating element(s) paired with another coil(s) or other magnetic field-receiving element(s). The coil(s) is(are) formed in or on a substrate which does not include some or all of the driver (i.e., input) or receiver (i.e., output) circuits. The coil(s) and magnetic field-receiving element(s) thus can be manufactured separately from the driver and/or receiver circuitry, using different processes, instead of subjecting the chip areas containing both input and output circuits to post processing to form the coil(s). Isolators can be assembled using such coils with a resultant lower cost. Isolators also can be assembled using transformers made from such coils wherein the transformers can be driven on either of their windings in order to provide bi-directional isolation with a single transformer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.