Heat dissipation device with a fan duct
US7545643B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 2, 2007 |
| Grant date | Jun 9, 2009 |
| Priority date | — |
| Expiry date | Sep 5, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation device adapted for cooling a heat-generating electronic component includes a heat sink (30), a fan (40) mounted on the heat sink (30), a fan duct (70) mounted on the fan (40) and a clip (50) securing the fan duct (70) on the fan (40). The fan (40) is sandwiched between a top of the heat sink (30) and a bottom of the fan duct (70). The clip (70) includes an axis (51) pivotably mounted on to a bottom of the fan duct (70), a locking portion (52) extending from an end of the axis (51) and buckled with the fan duct (70), and a pressing portion (53) bent from the axis (51) and engaging with a bottom surface of the top plate (42) of the fan (40).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.