Tin-coated printed circuit boards with low tendency to whisker formation
US7547479B2 · kind B2 · utility
15Cited by
19References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 23, 2005 |
| Grant date | Jun 16, 2009 |
| Priority date | — |
| Expiry date | Aug 25, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12861
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A coated article, which contains (i) at least one electrically non-conductive base layer, (ii) at least one layer of copper and/or a copper alloy, and (iii) a tin-containing layer, wherein the layer (ii) is positioned between the layer (i) and the layer (iii). The article is characterized in that the tin-containing layer (iii) contains at least one other metal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.