Method of manufacturing device having flexible substrate and device having flexible substrate manufactured using the same
US7547564B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 31, 2006 |
| Grant date | Jun 16, 2009 |
| Priority date | — |
| Expiry date | Dec 27, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K2102/311
Abstract
The present invention relates to a method of manufacturing a device having a flexible substrate and a device having a flexible substrate manufactured using the method.According to the method of manufacturing a device having a flexible substrate of the invention, glass is used as a mother substrate, a polymer layer, which is used as a substrate, is formed on the mother substrate using a chemical vapor deposition method or a vacuum evaporation method, a device is formed, and finally, the substrate where the device is formed is separated from the mother substrate, such that a large-scale device having a flexible substrate can be manufactured. Further, as a substrate forming an organic light emitting device and a sealant are formed of the same material, the device is not bent due to stress generated from the device itself after the device is manufactured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.