Method of mounting electronic circuit chip
US7549208B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 20, 2003 |
| Grant date | Jun 23, 2009 |
| Priority date | — |
| Expiry date | Feb 19, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49018
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
In a method of mounting a planar electronic circuit chip onto a flexible sheet together with another planar electronic element, the electronic circuit part and the another electric element are selected so that the planar surface of the another electric element is greater than the planar surface of the electronic circuit chip, and the another electric element and the electronic circuit chip are mounted on the sheet so that the planar surface of the another electric element and the planar surface of the electronic circuit chip are in parallel with the sheet surface, and the planer surface of the electronic circuit chip is accommodated within the planar surface of the another electric element as viewed in a direction perpendicular to the sheet surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.