Mounting method of electronic components
US7549221B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 14, 2006 |
| Grant date | Jun 23, 2009 |
| Priority date | — |
| Expiry date | Mar 31, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53187
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Methods of mounting electronic components on a plurality of printed circuit boards simultaneously are provided. An exemplary method may include supplying a first printed circuit board to a first conveyor and then transferring the first printed circuit board to a second conveyor and simultaneously supplying a second printed circuit board to the first conveyor. The method may then include transferring the first printed circuit board to a third conveyor and the second printed circuit board to a third conveyor, and mounting electronic components on about half of the first printed circuit board by moving the first printed circuit board to one side and, simultaneously mounting electronic components on about half of the second printed circuit board. The method may then include sequentially transferring the first and second printed circuit boards to a fourth conveyor, and then sequentially discharging the first and second printed circuit boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.