Method and apparatus for clamping a substrate
US7549371B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 10, 2006 |
| Grant date | Jun 23, 2009 |
| Priority date | — |
| Expiry date | Aug 23, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/1216
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A stencil printer for printing viscous material on a substrate includes a frame, a stencil coupled to the frame, and a print head, coupled for the frame, to deposit and print viscous material over the stencil. The stencil printer further includes a substrate support to support a substrate in a print position and a substrate clamping assembly to clamp the substrate in the print position. In a certain embodiment, the substrate clamping assembly includes a pair of rail members coupled to the frame. The rail members are adapted to engage opposite edges of the substrate. The substrate clamping assembly further includes a pair of foils, one for each rail member, with each foil being releasably secured to the rail member in a position so that the foil overlies the substrate. The substrate clamping assembly also includes a pair of clamping members, one for each rail member and foil, to releasably secure the foil in place on the rail member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.