Thermal transfer devices with fluid-porous thermally conductive core
US7549460B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 30, 2004 |
| Grant date | Jun 23, 2009 |
| Priority date | — |
| Expiry date | May 15, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A thermal transfer device (20) comprises a housing having a base assembly (23) and a cover (22). The base assembly (23) comprises a thermal transfer base (25) and a fluid-porous, thermally conductive mesh structure (26). The thermal transfer base (25) and the cover (22) cooperate to define a thermal transfer chamber (24). The thermally conductive mesh structure (26) is configured and positioned in the chamber (24) to provide a tortuous, thermal conduction path for fluid (e.g., a coolant) which turbulently travels from an inlet (40) of the chamber to one or more outlets (42) of the chamber (24). In some embodiments, the mesh structure comprises wires which are fused by diffusion bonding into a mesh, in other embodiments the mesh comprises a metallic wool. Within the chamber the mesh structure (26) can have various configurations for providing an exposure interface between fluid pumped through the chamber and the mesh.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.