Method of encapsulating an organic light emitting device
US7549905B2 · kind B2 · utility
3Cited by
20References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2005 |
| Grant date | Jun 23, 2009 |
| Priority date | — |
| Expiry date | Feb 19, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K50/844
Abstract
A method of forming an organic light emitting device on a substrate is provided, wherein the method includes forming an active device structure on the substrate, adhering a mask to the substrate, wherein the mask covers an electrical contact portion of the substrate while exposing the active device structure, forming an encapsulant layer over the active device structure and the mask, forming a separation between a portion of the encapsulant layer that covers the active device structure and a portion of the encapsulant layer that covers the mask, and removing the mask from the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.