Gas delivery substrate
US7550221B2 · kind B2 · utility
1Cited by
12References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 29, 2004 |
| Grant date | Jun 23, 2009 |
| Priority date | — |
| Expiry date | May 12, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A gas delivery substrate and method of manufacture is disclosed. A thermoplastic extrusion compound is created comprising a ceramic material and a thermoplastic resin, a green body is formed by thermoplastic extrusion of the compound, and the green body is sintered to form the gas delivery substrate. Such gas delivery substrates may be thin walled, highly porous and have secondary operations such as crimping and machining done prior to sintering.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.