Bonding structure and method of making
US7550365B2 · kind B2 · utility
1Cited by
33References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 27, 2005 |
| Grant date | Jun 23, 2009 |
| Priority date | — |
| Expiry date | Aug 21, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/1626
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
An electrical device includes an interconnect and a pair substrates at least one of which includes an integrated circuit, the pair of substrates being bonded together by a bond that includes a structure having multiple widths and a composition that is selected from the group consisting of a graded material and a first material upon a second material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.